High-power LED arrays use optimized chip-on-board technology for brilliant performance

In order to reap the benefits of high power LEDs, special requirements concerning thermal management and opto-mechanical layout have to be met, explains Oliver KÃ¼ckmann of PerkinElmer ELCOS GmbH. Since 1962, when the first red GaAsP LED was produced at General Electric, a lot of time and money has been spent developing more efficient LEDs to compete with other light sources. Eventually, the development and serial production of so-called power chips or high -current chips came about in 2000, enabling LEDs to penetrate a variety of different lighting applications.
It should be the same as the electrical input power, Efficiency and lowers the required electrical power.
While the efficiency of incandescent light sources is traditionally limited by the production of infrared radiation, LEDs are limited to conversion efficiency (electrical to optical) by non-radiative heat generation processes. To avoid damage to the LEDs sensitive p/n junction, excellent heat Conductive is needed throughout the entire LED assembly to dissipate this thermal energy to the ambient. Considerable effort is spent by LED manufacturers to increase the efficiency of every single component within the package, and all related components are chosen to achieve the highest radiant flux possible.
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This article was published in the February 2007 issue of LEDs Magazine.
To read the rest of this article, please visit our Magazine page, where you can download FREE electronic PDF versions of all issues of LEDs Magazine.
You can also request a print copy of LEDs Magazine (available by paid subscription). About the Author Oliver KÃ¼ckmann is an Application Engineer/Technical Marketing with PerkinElmer Elcos GmbH () in Pfaffenhofen, Germany. February 2007 Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec 2004 2005 2006 2007 2008 2009

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