Cypress Semiconductor Corp. today announced that its highly integrated single-chip Bluetooth low-power solution is now available in new packaging and temperature ranges. The PSoC® 4 BLE Programmable System-on-Chip and PRoCTM BLE Programmable On-Chip RF Solutions are now available in a micro-ball-on-chip package (CSP) optimized for secure credit card smart Bluetooth connectivity applications. The package is only 0.38 mm thick, making this Bluetooth-certified, reliable solution an ideal replacement for on-board chips.
Cypress also offers product options for operating temperatures ranging from -40oC to +105oC over the extended industrial temperature range. This provides stable product performance for industrial, automotive, and lighting applications that require operation in extreme weather conditions over this temperature range. The 128o and 256KB flash versions of the PSoC 4 BLE and PRoC BLE solutions are available in micro solder ball CSP packages and extended industrial temperature options. These new products are pin-compatible with Cypress's previous low-power Bluetooth solutions for easy upgrades.
Elan Sandhaus, vice president of Cypress's wireless product line, said: "The low-power Bluetooth market is growing very fast, and Cypress is constantly innovating for the requirements of emerging applications. These new CSPs and temperature options will give us The PSoC 4 BLE and PRoC BLE solutions for ease of use, programmability and stable low power performance bring more customers."
Cypress's customizable, low-power Bluetooth solution delivers unprecedented ease of use and high integration for IoT applications, home automation, wireless human interface (HID), remote control, medical, sports and fitness monitoring, and more. Among other wearable smart devices. PRoC BLE is a smart Bluetooth microcontroller with Cypress's industry-leading CapSense® capacitive touch sensing, while PSoC 4 BLE increases design flexibility by adding intelligent analog and programmable digital blocks. Both integrate Smart Bluetooth RF, a high-performance 32-bit ARM® CortexTM-M0 core with ultra-low power modes, up to 256KB of flash memory, 36 GPIOs, and customizable serial communication modules, timers and counter. In addition, both have an on-chip balun that simplifies antenna design while reducing board size and system cost.
In addition, Cypress offers the small-size Smart Bluetooth EZ-BLETM PRoCTM module. It integrates PRoC BLE, two crystals, an on-board antenna, metal shield and passive components into a small 10-mm x 10-mm x 1.8-mm size. It includes Bluetooth 4.1 certification and global frequency control certification, which greatly simplifies design and shortens time to market. Cypress is the only provider of chips, software, firmware and module hardware that can easily and smoothly support customers in remote controls, health and fitness equipment, home appliances, toys and other wireless applications. This combination of technologies provides unparalleled system value for smart Bluetooth products, extends battery life, has customized sensing capabilities, and delivers a smooth, intuitive user interface.
Low-power Bluetooth design tool
Designers who want to adopt smart Bluetooth in their products often need to use software from multiple vendors and develop complex firmware to comply with wireless standards. Cypress has extracted the low-power Bluetooth protocol stack and configuration profile into a royalty-free, GUI-based BLE “component†in the Cypress PSoC® CreatorTM Integrated Design Environment (IDE) Drag and drop the component to place it in the design. A complete system design can be implemented with PSoC Creator software, which significantly shortens the time to market. As an alternative, users of Eclipse® and other ARM-based tools can also customize their low-power Bluetooth solution in PSoC Creator and then export the solution to their own IDE.
The $49 Cypress CY8CKIT-042-BLE Development Kit makes it easy to use Cypress's Bluetooth low energy devices and maintain the original design foundation based on the PSoC 4 Pioneer Kit. The development kit includes a USB low-power Bluetooth transceiver that can be paired with the CySmartTM master emulation tool to turn the designer's Windows® PC into a low-power Bluetooth debug environment. Cypress also offers two ready-to-produce reference design kits (RDKs) that enable customers to bring products to market faster. These two kits are the CY5672 remote control RDK and the CY5682 touch mouse RDK.
Availability
The new PSoC 4 BLE and PRoC BLE solutions in the 128KB flash version are currently sampling. You can contact the Cypress sales team or obtain samples from a Cypress Authorized Dealer. The PSoC 4 BLE data sheet and the PRoC BLE data sheet can be downloaded from the website (the product model details are included in the ordering information in the data sheet).
About Cypress
Cypress (NASDAQ: CY) provides the core high performance, high quality solution for today's most advanced embedded systems for automotive and industrial and networking platforms to highly interactive consumer and mobile A wide range of equipment. We have a broad line of products for heterogeneous products including: NOR Flash, F-RAMTM and SRAM, TraveoTM microcontrollers, the industry's only PSoC® programmable system-on-chip solution, analog and PMIC power management ICs, CapSense® capacitive Touch-sensing controller, wireless BLE low-power Bluetooth and USB connectivity solution. Cypress is committed to providing innovative, industry-leading support and superior system value to customers around the world.
1.ANTENK Wire to Board connectors are avialable in different terminations and sizes intended for use on a variety of applications. These connectors provide power and signal with different body styles, termination options, and centerlines. To find the wire to board set required, click on the appropriate sub section below.
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Wire to Board Connectors Information
Description
Wire-to-board connectors are used to interconnect printed circuit boards (PCBs) by using connectors attached to wires.
Specifications
Specifications for a wire to board connector include the following.
Wire-entry angle - There are three wire-entry angle styles: vertical, right-angle, and bottom-entry.
Wire size - Wire size is usually measured in American wire gauge (AWG), a standard for non-ferrous wire conductor sizes. The term "gauge" refers to the wire`s diameter. The higher the gauge number, the smaller the diameter and the thinner the wire.
Circuits or positions - With wire to board connectors, the number of circuits or positions may range from 1 to 120.
Pitch or center spacing - Pitch or center spacing is measured in millimeters (mm) or inches.
Lock to mating style - There are three basic lock-to-mating styles: positive, friction, and friction ramp.
Maximum current - The maximum current or current-carrying capacity is measured in amperes (A) and ranges from 1.0 A to 50. A.
Termination Methods
Crimp is the physical compression of a contact wire around a conductor to make an electrical and mechanical connection. Insulation displacement connectors (IDC) slice through the cable insulation to make a connection. Choices for termination method also include cage clamp, screw, tabs, and solder cups.
PCB Mounting Styles
With wire to board connectors, there are four choices for PCB mounting.
Through-hole technology (THT) mounts components on a PCB by inserting component leads through holes in the board and then soldering the leads in place on the opposite side of the board.
Surface mount technology (SMT) adds components to a PCB by soldering component leads or terminals to the top surface of the board. SMT components have a flat surface that is soldered to a flat pad on the face of the PCB. Typically, the PCB pad is coated with a paste-like formulation of solder and flux.
Press-fit and compression-style Board To Board Connectors are also commonly available.Wire to Board Connectors Information
Standards
Wire-to-board connectors carry approvals from various national and international organizations. In North America, they often bear marks from Underwriters Laboratories (UL) and/or the Canadian Standards Association (CSA).
A wire to board connector for the European marketplace should comply with the Restriction of Hazardous Substances (RoHS) and Waste Electrical and Electronic Equipment (WEEE) directives from the European Union (EU). Wire-to-board connectors that comply with other requirements are also available.
BS 9526 N0001 - Specification for multi-contact edge socket electrical connectors.
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