New York Governor Andrew M. Cuomo announced earlier this week that a number of semiconductor companies led by Intel and IBM will invest $4.4 billion in the construction of semiconductor R&D centers in New York over the next five years to develop next-generation chip technologies.
The investment is focused on two projects, one led by IBM and its partners, focused on building the next two generations of semiconductors; the other, led by Intel, will develop process technology for 450mm wafers, known as the Global 450 Consortium (Global 450 Consortium).
According to the statement, Intel has joined the 450mm development efforts of IBM, TSMC, Globalfoundries, and Samsung Electronics. Intel separately agreed to establish its East Coast headquarters in Albany, the capital of New York, to support the project.
An IBM spokesperson said that the company will work with Samsung and Globalfoundries, partners of the Common Platform Process Technology Alliance, to develop 22nm and 14nm chips. More details of the development work will need to be determined later. Of the $4.4 billion invested in these two projects, 3.6 billion came from IBM. With this investment, IBM has invested more than US$10 billion in chip technology in New York State over the past decade.
The agreement stipulates that private companies cannot obtain any state government funding. It is not yet clear whether the participating companies will be able to obtain tax breaks or other policy support in the New York state. In support of the project, New York State will invest US$400 million in SUNY Nano and Science and Engineering College (CNSE) in Albany over the next five years. Of these, there are 100 million U.S. dollars for the study of energy efficiency and low-cost energy distribution.
The Governor of New York, Cuomo, said that the state won this investment after competing with many countries in Europe, Asia, and the Middle East.
According to the New York State Governor’s Office, the two R&D projects will create 4,400 jobs and keep an additional 2,500 jobs. About 2,500 high-tech jobs in these 4400 jobs will be provided to CNSE's Intelligent System Technology and Commercialization Center.
Governor Guomo said in a statement: "This unprecedented private investment in the economic history of New York State will create thousands of jobs and make New York City the center of next-generation computer chip technology."
Some chip makers - including some of the 450 companies involved in the global consortium - are still in the early stages of 300mm to 450mm wafer over-process. This will double the number of chips produced per wafer. Equipment vendors had previously resisted the transition to new wafer sizes, but eventually they joined in and began producing early production tools.
Intel’s President and CEO Paul Otellini stated in a statement issued by the State of New York that the Global 450 consortium is critical to the transition of the chip industry to the next-generation wafer size.
He said: "The new technology will reduce production costs, increase manufacturers' productivity, and reduce the average impact of each chip on the ecological environment."
The investment is focused on two projects, one led by IBM and its partners, focused on building the next two generations of semiconductors; the other, led by Intel, will develop process technology for 450mm wafers, known as the Global 450 Consortium (Global 450 Consortium).
According to the statement, Intel has joined the 450mm development efforts of IBM, TSMC, Globalfoundries, and Samsung Electronics. Intel separately agreed to establish its East Coast headquarters in Albany, the capital of New York, to support the project.
An IBM spokesperson said that the company will work with Samsung and Globalfoundries, partners of the Common Platform Process Technology Alliance, to develop 22nm and 14nm chips. More details of the development work will need to be determined later. Of the $4.4 billion invested in these two projects, 3.6 billion came from IBM. With this investment, IBM has invested more than US$10 billion in chip technology in New York State over the past decade.
The agreement stipulates that private companies cannot obtain any state government funding. It is not yet clear whether the participating companies will be able to obtain tax breaks or other policy support in the New York state. In support of the project, New York State will invest US$400 million in SUNY Nano and Science and Engineering College (CNSE) in Albany over the next five years. Of these, there are 100 million U.S. dollars for the study of energy efficiency and low-cost energy distribution.
The Governor of New York, Cuomo, said that the state won this investment after competing with many countries in Europe, Asia, and the Middle East.
According to the New York State Governor’s Office, the two R&D projects will create 4,400 jobs and keep an additional 2,500 jobs. About 2,500 high-tech jobs in these 4400 jobs will be provided to CNSE's Intelligent System Technology and Commercialization Center.
Governor Guomo said in a statement: "This unprecedented private investment in the economic history of New York State will create thousands of jobs and make New York City the center of next-generation computer chip technology."
Some chip makers - including some of the 450 companies involved in the global consortium - are still in the early stages of 300mm to 450mm wafer over-process. This will double the number of chips produced per wafer. Equipment vendors had previously resisted the transition to new wafer sizes, but eventually they joined in and began producing early production tools.
Intel’s President and CEO Paul Otellini stated in a statement issued by the State of New York that the Global 450 consortium is critical to the transition of the chip industry to the next-generation wafer size.
He said: "The new technology will reduce production costs, increase manufacturers' productivity, and reduce the average impact of each chip on the ecological environment."
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