The heat dissipation and reliability of components and systems are two important issues in semiconductor lighting . During the EuroSimE2011 international academic conference held in the industrial town of Linz, Austria, international experts conducted academic reports and exchanges on these two topics, and answered questions such as how Use carbon nanotubes for heat dissipation? How to use simulation to accurately predict the heat dissipation of 8W replacement bulbs and 3W LED arrays? How to break through the limitations of LED chip simulation and carry out reliability simulation of the entire luminaire system. At the meeting, two European large-scale, multinational semiconductor lighting research projects SE2A (automotive electronic component development, automotive SSL headlights) and CSSL (alternative bulbs) project directors, overview of the two projects, management methods and progress Reported.
Thermal analysis and innovative design of semiconductor lighting
　　 Regarding the thermal analysis and heat dissipation design of semiconductor lighting, Zhang Kai from Hong Kong University of Science and Technology introduced how to use the active cooling system made of piezoelectric materials and carbon nanotubes as thermal interface materials to solve the heat dissipation problem of high-brightness LEDs. The biggest benefit of using an active cooling system is its heat dissipation efficiency. This study found that using an active cooling system can reduce temperatures up to 37 °C. The biggest benefit of an active cooling system made of piezoelectric material is that it has no mechanical parts, so less wear on mechanical parts will increase the life and reliability of the active cooling system.
Ye Huaiyu from Delft University published his project team's thermal analysis of semiconductor lighting and how to solve its heat dissipation problems through more effective design. Taking a different approach to cooling than Zhang Kai, he mainly uses passive cooling systems to reduce the cost of the lighting system. He advocates the problem of high temperature junctions by optimizing the design of the LED's thermal path, including redesigning the lighting system's architecture to increase heat dissipation.
Jiri Jakovenko of the Czech Institute of Technology published a thermal simulation and experimental verification of an 8W replacement bulb for semiconductor lighting. The authors have simulated the LED package , drive electronics, heat dissipation mechanism, light conversion mechanism, and secondary optics of the alternative bulb, and experimentally proved that the error between the experiment and the simulation is only 10%. He believes that simulation technology can accurately predict the temperature of the junction.
Fengze Hou from Guilin University of Electronic Technology analyzes the thermal performance of the heat sink fins of the 3W LED array system to more accurately predict the temperature of the semiconductor lighting fixtures. Sima Tarashioon of Delft University experimentally studied the degradation of the driving electronic components of semiconductor lighting at high temperatures. For example, at 110 ° C, a ceramic capacitor (nominal temperature of 125 ° C) has been integrated. The efficiency of the circuit has dropped by 2% to 3%. A driver circuit consists of several ceramic capacitors and inductors. At high temperatures, the actual efficiency of the drive circuit will be significantly different from the design efficiency.
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Storage temperature range:
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â—Use with a load that exceeds the rated torque
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â—Use in which the permitted overhang load or the permitted thrust load is exceeded
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