Founded in 2004, Shenzhen Chenri Technology Co., Ltd. has been committed to the research and development and production of semiconductor packaging materials, LED packaging materials and electronic assembly materials. At present, it has 5 invention patents and 7 utility model patents.
From 2009 to 2010, Chenri Technology successfully developed a solid crystal solder paste with a thermal conductivity of 35-64W/mK, which can meet the needs of high-power LED chips and other chip packages with high heat dissipation requirements. The conductive silver glue solves the heat dissipation problem of the high-power silver plastic package, improves the service life of the high-power LED and the stability of the output, and can also enhance the bonding strength of the chip and greatly reduce the packaging cost.
After successfully developing solid-state solder paste in 2011, Chenri Technology saw that the follow-up market scale of LED packaging rubber will continue to expand, and in the first year of COB development in 2012, it successfully launched the dam glue. Although the dam rubber is a small part of the COB package, after taking most of the domestic COB packaging customers, Morning Technology is more confident in the next step of developing silica gel materials.
Therefore, Chenri Technology has built a research and development team consisting of doctors and masters, specializing in the development of LED silica gel, and successfully launched filament glue, COB glue, and patch glue.
On the evening of December 22nd, at the 2017 Hi-Tech LED Awards Ceremony hosted by Gaogong LED and the exclusive title of Roundmans, Chenri Technology won the annual innovation technology golden ball award for the annual packaging materials category with the new technology of filament rubber. .
Measuring value with reputation, taking the lead in innovation and winning the market with quality. Over the years, the selection of the high-tech LED Golden Globe Award has become the vane of industrial innovation and brand influence.
In 2017, the high-tech LED Golden Globe Awards were selected as "one enterprise, one ingenuity is the "smith", and the "heart"". Since the opening of the registration channel in early November, more than 130 LED industry chains have been on the chain. Middle and lower reaches companies sign up for participation. Participating companies cover the entire industry chain of LED materials, equipment, chips, packaging, lighting.
On the evening of December 22nd, the 2017 Gaogong LED Golden Globe Awards Ceremony was held in Shenzhen Baoan Dunxi International Hotel. On-site industry elites witnessed the LED industry's annual grand ceremony. The Golden Globe Awards Ceremony was exclusively named by Land Vans, and the Golden Globe Awards Ceremony was also supported by the Incentive Testing.
Morning Technology won the Golden Globe Award in this industry's annual grand ceremony. It is understood that the newly developed LED filament encapsulant is a one-component high thixotropic silica gel with good formability, high transparency, strong adhesion and easy operation. At the same time, the technology has optical properties such as high brightness, high light efficiency and low light decay. After the product is cured, it can be cracked, yellowed and hardened after being aged for a long time at 300 °C.
In addition, the packaged filament can be ignited for 500 hours at high temperature to ensure no dead light, the light decay is only 5% or less, and the reliability is high. The filament adhesive can be used for high current filament package of 20mA or more.
LED filament encapsulant is a self-developed product of Chenri Technology. Its core materials include resin and tackifier. All of them are laboratory synthesis, especially the preparation of high-efficiency heat-resistant resin. It has achieved key technological breakthroughs, making Chenri Technology The filament adhesive is superior to the Japanese imported brand of filament adhesive in heat aging resistance, and is in a leading position in the industry.
Qian Xuexing, general manager of Morning Technology, said, “The newly developed this filament adhesive has been upgraded on the basis of the original filament adhesive. In addition to the significant improvement in optical performance and aging reliability, the formability of the product, The safety of use has also been greatly improved, which largely solves the problems of flow glue and collapse which are easy to occur in the past.
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