A few days ago, CEC Electronics Equipment Group Co., Ltd. (hereinafter referred to as "Electrical Equipment") received good news. The first domestic beam ion implanter independently researched and developed has more than 2 million stable flow sheets on the SMIC's large production line, the first 200mm CMP. The equipment achieved sales. This is a microcosm of major achievements in the science and technology major projects (hereinafter referred to as the “02 special projectsâ€) under which the electrical equipment is responsible for the “very large scale integrated circuit manufacturing equipment and complete sets of processesâ€.
To build a high-end equipment for high-end heavy-duty chips to a new journey
In the past 9 years, the electrical equipment has undertaken a special 02 "90-65nm high-angle ion implanter research and development and industrialization," "the key components of the packaging equipment and core technology," "45-22nm low-energy beam ion implantation machine R & D and industrialization" " 28-14nm polishing equipment and complete sets of processes, material industrialization "" 300mm thin wafer thinning polishing machine research and development and industrialization "and other projects.
In the past 9 years, with the support of 02 special projects, the electrical equipment has broken key technologies such as ion implanter, chemical mechanical polishing equipment (CMP), etc., which are difficult to tackle and have strong driving force; and have obtained invention patents. 146 The project won 22 provincial or ministerial awards; a batch manufacturing platform for ion implanters conforming to the SEMI standard was established; a postdoctoral scientific research workstation was established; and the CMP R&D platform was approved as “Beijing Chemical Machinery Flattening Process Equipment Engineering Technology Research Centerâ€; China's first ion implanter and 200mm CMP equipment enter SMIC's large-scale production line. Advanced packaging equipment has integrated service capabilities and has entered the leading domestic leading packaging companies...
Responsibility and responsibility for writing core stones
Integrated circuit chip is the core cornerstone of the information age. Integrated circuit manufacturing technology represents the highest level of ultra-precision manufacturing in the world today. The integrated circuit industry has become a strategic industry that affects social security, economic security, and national defense.
However, due to the capital-intensive, technology-intensive, and talent-intensive nature of the integrated circuit industry, China's integrated circuit industry has long been subject to various restrictions in advanced manufacturing equipment, materials, and processes. The high-end chips mainly rely on imports. China's integrated circuit products have been imported for more than 200 billion U.S. dollars a year for many years, surpassing oil as the largest import product.
In order to achieve the development of independent innovation, in 2008 the country launched the 02 special project, focusing on independent innovation in equipment, processes and materials.
Zhang Boxu, director of Beijing Economic and Information Commission, stated that high-end equipment and materials fill the gaps in the industrial chain from scratch, and the integration of manufacturing processes and packaging has grown from weak to strong to the world to participate in international competition. This shows that major national science and technology projects have created an innovation system for IC manufacturing. Sexual goals have been achieved. In the vigorous development of China's integrated circuit industry in recent years, major projects have played a significant role in innovation leadership and technical support.
In the special high-level equipment research and development of 02, the electrical equipment plays a decisive role.
The electrical equipment is a wholly-owned subsidiary of China Electronics Technology Corporation (hereinafter referred to as China Electronics). It was established in 2013 and is integrated by the second, forty-five and forty-eight and its 11 holding companies. , across Beijing, Taiyuan, Changsha, Shanghai and other six provinces and eight parks.
Since its establishment, the Electronics Division has upheld the banner of the national team of electronic manufacturing equipment, and carried forward the ten-year-old-sword-building equipment spirit that can endure hardship, give dedication, and adhere to it, in accordance with the key breakthroughs, platform support, partial integration, and integrated services. Develop ideas, adhere to innovation and development, adhere to the integration of military and civilian, insist on equipment to serve the country, and overcome key technologies such as ion implanter, chemical mechanical polishing equipment, and key equipment for integrated circuit manufacturing, and resolve a number of constraints on the autonomous and controllable development of military electronic components in China. The problem of “knocking the neck†has supported the rapid development of semiconductors and emerging electronic component industries, and has written the responsibilities and responsibilities of the major power devices.
Relying on many years of technology accumulation in the field of integrated circuit core equipment and military research and production technology, the electronic equipment has formed a complete set of integrated semiconductor equipment and integrated service capabilities such as high-end display, photovoltaic new energy, and power battery materials, which has greatly increased the localization rate of equipment. At present, it is the main domestic integrated circuit equipment, the largest high-end display equipment, photovoltaic manufacturing equipment, and power battery material manufacturing equipment suppliers. It has the ability to integrate local integrated circuits and system integration capabilities, and has a complete photovoltaic industry chain and complete line turn-key capability.
Breaking monopoly to forge domestic brands of ion implanters
Breakthrough key technologies, obtained 101 invention patents and 2 international patents, and have achieved serialized products for SMIC's 90nm, 55nm, 40nm, and 28nm process production lines... This is an electrical equipment undertaking commitment to 02 special two ion implanter research and development Some of the results achieved by the project.
Ion implanters are the key equipment for the manufacture of integrated circuits—primarily by injecting particles into semiconductor materials to control the conductivity of semiconductor materials, thereby forming the basic unit of integrated circuit devices such as PN junctions.
As the only supplier of ion implantation equipment integrating R&D, manufacturing and service in China, the Electronics Division has taken over the specialization of 02, and has achieved a new level in the research and development of ion implanters.
In 2014, the 12-inch beam ion implanter passed the acceptance inspection of the National 02 Special Implementation Management Office. In 2015, SMIC successively completed the process validation for 55nm, 45nm, and 40nm products in small batches, and the first domestic beam ion implanter took the lead in realizing the production of over one million wafers. In 2016, we launched a new 45- to 22-nm low-energy large-beam ion implanter that satisfies high-end processes, and a series of medium-beam and low-energy large beam products are used in large-scale IC lines. In 2017, the plant and process laboratory for mass production of ion implanters were put into use. The company has an industrialized platform that conforms to the SEMI standard and has an annual production capacity of 50 units. It also uses an information management system to achieve full quality control and traceability of the batch manufacturing of ion implanters.
“To accumulate equipment, for the equipment manufacturing industry, we must not only pay attention to the development of a single device, but provide complete sets of supplies within a certain range, and it is more important to form a platform for production capacity.†Liu Jidong, chairman and party committee secretary, emphasized that The independently developed ion implanter broke the monopoly of the high-end market by the United States and Japan and created a domestic brand of ion implanters.
Zero Breakthrough Domestic 200mm CMP Enters SMIC Line Verification
On November 21st, the 200mm CMP commercial aircraft independently developed by the Electronics Division completed internal tests and sent it to SMIC Tianjin for on-line verification. This is the first time China-made 200mm CMP equipment enters the integrated circuit production line, effectively solving the bottleneck problem that restricts the autonomous and controllable development of China's integrated circuit industry.
CMP is one of the seven key devices for integrated circuit manufacturing and is used for planarization and copper interconnection processes.
The electrical equipment is facing difficulties and the two ends have strength. While undertaking the "12th Five-Year Plan" 02 special project "28-14nm polishing equipment and complete sets of processes, materials industrialization" project, facing the urgent needs of the domestic market, independent investment in the development of 200mmCMP commercial equipment, the formation of 300mm, 200mm equipment research and development go hand in hand, mutual Supporting situation.
Since January 2015, the CMP equipment R&D team of the electric equipment company has spent countless sleepless nights and finally poured out the flowers of CMP equipment industrialization: it has broken through more than 10 key technologies and completed more than 50 technical improvements, finally in 2017. In August of this year, the company successfully developed the first domestic 200mm CMP commercial machine with completely independent intellectual property rights, successfully breaking the foreign technology blockade monopoly. After strict 10,000 "marathon" tests, the device is currently comparable to similar international equipment.
It is reported that in the next 6 months, the 200mm CMP equipment should formally undergo the test of large-scale production, and the reliability and consistency of the equipment will undergo rigorous assessment.
Complete supply of key equipment for advanced packaging in bulk for leading companies
More than 2,000 sets of packaging equipment have been sold and have been applied in batches to domestic well-known packaging and testing companies such as Changjiang Electronics, Tongfu Microelectronics and Suzhou Jingfang. In the field of high-end packaging equipment, the electronic equipment has formed a partial supply capacity.
Since the “Eleventh Five-Year Planâ€, under the support of the special project of 02, the electrical equipment has successively undertaken technical and product development projects such as the 300mm ultra-thin wafer thinning and polishing integrated machine and key components and core technologies of the packaging equipment.
Today, the flip chip bonders, automatic wafer thinning machines, and automatic precision scribing machines developed by the electric equipment industry have reached leading domestic and international advanced levels; and localized integrated circuit packaging equipment has been built with self-developed equipment. The verification line provides a good platform for continuously improving the stability and reliability of domestic integrated circuit packaging equipment.
"In the development of equipment, it is necessary to develop equipment design and manufacturing based on process requirements, and to continuously perform process validation," said Liu Jidong.
At present, the packaging equipment process verification line has three major functions: First, verification equipment, verification technology, thinning, scribing, flip-chip, wire bonding and other equipment in the verification line for stability, reliability, process adaptability Verification and verification; secondly, verify the equipment's batch production and enhance the capacity of equipment batch delivery; thirdly, strengthen the capacity of partial line-up and accumulate experience for providing overall solution.
Responsibility calls for responsibility, mission leads the future
As the national team in the field of electronic manufacturing equipment, the electronic equipment will continue to uphold the important task of equipment to serve the country, build electronic high-end equipment, and build a national core. In the future, by focusing on the key technology of core equipment for integrated circuit manufacturing, the electronic equipment will adhere to scientific and technological innovation and industrial investment in two-wheel drive, and continue to exert force. Focusing on related industries under the support of the equipment and equipment industry, we will focus on upgrading the level of industrialization. We will build internal equipment for outreach and resources, build Beijing IC equipment innovation center and industrialization base, and China Electronics (Shanxi) Electronic Information Technology Innovation Industrial Park. And Changsha Photovoltaic Equipment Industrial Park, serving the national and local development; at the same time, nurturing the ability of intelligent manufacturing electronics subdivision industry standard formulation, smart equipment manufacturing and intelligent manufacturing system solutions, and becoming the mainstream intelligent manufacturing enterprise in the country and the intelligent manufacturing system. One of the program providers.
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